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Virtex-6 LX760 FPGA 1~12개 탑재 가능한 SoC/ASIC
- 설계 및 검증
FPGA 게이트 7천만~5억, ASIC 게이트 7백만~5천만
- 수용 가능
ARM Cortex A8, ARM11 (S3C6410), ARM926, ARM1136,
- MPCore 설계
ADC/DAC, DVI, PCIe, USB/Ethernet,HDMI 설계
FPGA 전 핀에 Trace Length Matching 설계로 컨넥터
- Skew 최소화
LVDS Impedance 매칭으로 고속 LVDS 동작
I/O 핀 모듈형태로 설계
Clock Generator및 Fan-out Buffer 적용으로 Clock
- Skew 최소화
각 커넥터별로 전원이 분리되어 다양한 주변장치
- 모듈을 동시에 사용
Xilinx MIG를 통해 생성한 메모리 컨트롤러를 사용
SystemACE 내장으로 대용량 Configuration
JTAG을 통한 ILA 사용 가능

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Item |
Specification | |
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FPGA Module Site |
Rapid ASIC/SoC Prototyping System with Quad Xilinx Virtex-6 LX760 FPGAs - Xilinx Virtex-6 LX760 FPGA 모듈 4개 기본 탑재, 8개까지 확장이 가능 | |
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Main Clock Source |
ISPCLK5620AV *3ea (1~340MHz) IDT5T9310 * 1ea(31.25~700MHz) | |
|
Reference Clock |
3 PLL(ICS8402) : 16 ~ 340MHz 1 PLL(IDT84329B) : 31.25~700MHz) | |
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Clock Connector |
4 Source and 16 Clock in/out connectors for each FPGA - Clock source(total 4ea) : 16~340MHz Clock Generator 3ea, 31.25~700MHz 1ea - Clock connectors ▪ 4 Differential/4 Single-Ended Clock In/out Connectors 8ea(FPGA Module) ▪ 4 Differential/4 Single-Ended Clock out Connectors 8ea(FPGA Module) ▪ 4 Diffrential/4 Single-Ended Ext.Reference Clock In Connectors(Baseboard) ▪ 3 Differential/3 Single-Ended Feedback Clock In Connectors(baseboard) ▪ 2 Differential / 2 Single-Ended Clock Out Connectors(Baseboad) ▪ 2 Differential Clock Out Connectors(Baseboard) | |
|
Total I/O Pins |
Total 1159 I/Os : Flexible I/O - 1920 I/Os : 120pins Connectors 16ea (FPGA Module Upper side) - 160 I/Os : 120pins Connector 1ea(FPGA Module Upper side) - 480 I/Os : 120pins Connectors 4ea (Base Board side) FPGA Interconnction - A↔B : 272, C↔D : 272 signals | |
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External I/O Connector |
FA_C1L(120), FB_C2L(120), FC_C3L(120), FD_C4L(120) | |
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ETC I/O |
Reset(1) | |
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Configuration JTAG |
On Board SystemACE/JTAG, SelectMAP Module Connector | |
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Power |
ATX 600W Power Supply | |
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ETC Regulator |
2.5V/5A Regulator *1ea 3.3V/5A Regulator *1ea | |
|
FPGA VCCO Regulator Modules 9 Vcco regions |
2.5V/1.8V/1.5V/1.2V * 9ea | |
검증용 확장 모듈|
Item |
Specification |
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CON 1X1 |
1 connector for stackable height |
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CON 2X1 |
2 interconnect for 2 horizontal connector |
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CON 1X2 |
2 interconnect for 2 vertical connector |
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PROBE HEADER |
HEADER CONNECTORs for Probing - 1 Connector use - 40 header * 4 |
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PROBE MICTOR |
MICTOR CONNECTORs for Probing - 1Connector use - MICTOR Connector * 4 |
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32MB NorFLASH |
32MB Nor Flash - Datawidth : 32bit - 1 connector use |
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64MB SDRAM |
64MB 32bit Mobile SDR SDRAM Module - Datawidth : 32bit - 1 connector use |
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128MB DDR SDRAM |
128MB 32bit Mobile DDR SDRAM Module - Datawidth : 32bit - 1 connector use |
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DDR2 SO-DIMM |
DDR2 SO-DIMM for DDR2 SDRAM - Datawidth : 64bit - 2 connectors use |
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DDR3 SO-DIMM |
DDR3 SO-DIMM for DDR3 SDRAM - Datawidth : 64bit - 2 connectors use |
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UART/USB2.0 |
2 UART port, USB High-speed GPIF(CY7C68013A) - 1 connector use |
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Gigabit Ethernet Phy |
Gigabit Ethernet Phy(M88E111) - 1 connector use |
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PCI Express Phy |
PCI Express Phy 1Lane(PX1011) - 1 connector use |
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Item |
Specification | ||
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S3C6410 (ARM11) Module |
A. S3C6410 CPU B. 128MB mDDR, 1GB NAND, MicroSD Socket C. USB HOST 1port, OTG 1port UART 2port D. 229 GPIO available (2*120pin connectors) E. Connectors are compatible for MFP Series and RPS Series | ||
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ARM CT11MPCore |
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Four ARM11 MPCore CPUs with VFP and 32KB L1 caches 1MB of unified L2 cache 2 external multiplexed AXI interfaces Tile form factor High density stacking connectors | |
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ARM1176 Core Tile |
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Single ARM1176JZF-S CPU with VFP and 16KB caches and TCMs 128KB of internal AXI RAM ARM *TrustZone Technology On chip ETM11CS with external MICTOR trace connector External multiplexed 64-bit AXI interface | |
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ARM1136 Core Tile |
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ARM1136JS-F processor test chip Tile form factor High density stacking connectors Two PISMO™ connectors for memory expansion boards | |
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ARM926 Core Tile |
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ARM926EJ-S processor test chip Tile form factor High density stacking connectors Two PISMO™ connectors for memory expansion boards | |
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ARM7 TDMI |
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ARM7TDMI processor test chip Tile form factor High density stacking connectors Two PISMO™ connectors for memory expansion boards | |
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TI DSP TMS320C6416 Module |
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TI DSP TMS320C6416 SDRAM included | |
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Core Tile Adaptor |
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ARM Core Tile to FPGA Modules | |
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ASIC / SoC Prototyping |
Image Processing 설계및검증 |
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• SoC Rapid Prototyping |
• MPEG, MPEG4, M-JPEG, H.264 |
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Core Prototyping |
High Speed Test Platform |
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• Cortex A8, Cortex A9, • Cortex M3 • Cortex M0 • ARM11, ARM9, ARM7 • Core A, NEON |
• WiBRO Modem Test Platform |
SoC/ASIC 프로토타이핑 설계 주요실적
1) MFP-LX330-Nine Board

2) RPS7000 & optional boards
3) ARM Core, FPGA 적층 구조 설계, ARM926/1136, XilinX FPGA 적층 구조 설계

4) ARM Emulation Base + MPCore + XilinX FPGA

5) Huins SoC Verification Platforms
l RPS-3000 Virtex LX330+ARM CoreTile

l RPS-3000 Virtex LX330+ 2 ARM CoreTile

l Virtex-5 FPGA Module with DRAM

l XilinX Virtex4 + Altera Excalibur (ARM922T)

l Altera Excalibur (ARM922T)+ XilinX FPGA

l MFP-LX330Q

l Altera Excalibur SoC 검증 플랫폼, ARM922T+FPGA, 2003

























































































