- HOME
- Products
- Soc Solution
-
-
SoC/ASIC Prototyping system with 4~8 Virtex-6 LX760 FPGA
FPGA Gates : 280M Gates~ 500M Gates,
ASIC Gate: 28M Gates ~ 50M Gates
8 RPS-760M Logic Tile can be stacked
Interface Adaptor for ARM Cortex A8, ARM11 (S3C6410),
ARM926, ARM136
Trace Length Matching for minimizing skew
LVDS Impedance matching for LVDS operation
Support DDR2/DDR3 SDRAM by XilinX MIG
Supports peripherals
Clock Generator and Fan-out Buffer
JTAG and SelectMAP Configuration
SystemACE Configuration
-
It is very important for user to use ¡°clock¡±. It should be designed carefully for stable operation on the platform.
The RPS-7604 base board has four global clocks. The three of them can be used for 1~340Mhz and the one of them can be used for 31.5~700MHz. There are adjustable by DIP switch. Total four global clocks drive RPS-760M. It is minimized skew.
The RPS-760M receives four global clocks as LVDS or single ended clock from base board.
The RPS-760M has 16 clock I/O pins for global clock.
RPS-LX7604 Base board Clock Diagram
Rapid Bus Architecture for CPU, FPGA, I/O peripherals.
The Rapid Bus is interconnection between FPGA and peripherals. The RPS-7604 has four RPS-760M Logic tiles that has 8 upper connectors with 120 pins. This is ¡°Rapid Bus¡± for high speed I/O connections. For examples, FPGA module, CPU module, DDR3/DDR2 SDRAM module, debugging module, communication module, DVI module, ADC/DAC modul, USB, Ethernet, PCI Express, SATA, ARM Core, Logic Analyzer.
System ACE
XC6VLX760 is configured by SystemACE.
The JTAG configuration port for the board allows for device programming and FPGA debug. This interface can be used with a Parallel Cable III or Parallel Cable IV cable for JTAG programming and debugging via the JTAG configuration port.
Power
The power supply for RPS-7604 is 400W ATX Power Supply. The nine power regions on the board are separated from each connectors. And, It can be adjustable from 2.5V to 1.2V by switch. The board has a power switch. The power switch enables delivery of all power to the board.
RapidBus Psecifications
unction |
Polarity |
Signal |
Pin# |
Pin# |
Signal |
Polarity |
Function |
Note |
MRCC |
P |
FC20 |
2 |
1 |
FC0 |
P |
¡¡ |
BANK A |
MRCC |
N |
FC21 |
4 |
3 |
FC1 |
N |
¡¡ | |
SRCC |
P |
FC22 |
6 |
5 |
FC2 |
P |
¡¡ | |
SRCC |
N |
FC23 |
8 |
7 |
FC3 |
N |
¡¡ | |
VRN |
P |
FC24 |
10 |
9 |
FC4 |
P |
¡¡ | |
VRP |
N |
FC25 |
12 |
11 |
FC5 |
N |
¡¡ | |
¡¡ |
P |
FC26 |
14 |
13 |
FC6 |
P |
¡¡ | |
¡¡ |
N |
FC27 |
16 |
15 |
FC7 |
N |
¡¡ | |
¡¡ |
P |
FC28 |
18 |
17 |
FC8 |
P |
¡¡ | |
VREF |
N |
FC29 |
20 |
19 |
FC9 |
N |
VREF | |
¡¡ |
P |
FC30 |
22 |
21 |
FC10 |
P |
¡¡ | |
¡¡ |
N |
FC31 |
24 |
23 |
FC11 |
N |
¡¡ | |
¡¡ |
P |
FC32 |
26 |
25 |
FC12 |
P |
¡¡ | |
¡¡ |
N |
FC33 |
28 |
27 |
FC13 |
N |
¡¡ | |
¡¡ |
P |
FC34 |
30 |
29 |
FC14 |
P |
¡¡ | |
¡¡ |
N |
FC35 |
32 |
31 |
FC15 |
N |
¡¡ | |
¡¡ |
P |
FC36 |
34 |
33 |
FC16 |
P |
SRCC | |
¡¡ |
N |
FC37 |
36 |
35 |
FC17 |
N |
SRCC | |
¡¡ |
P |
FC38 |
38 |
37 |
FC18 |
P |
MRCC | |
¡¡ |
N |
FC39 |
40 |
39 |
FC19 |
N |
MRCC | |
MRCC |
P |
FC60 |
42 |
41 |
FC40 |
P |
¡¡ |
BANK B |
MRCC |
N |
FC61 |
44 |
43 |
FC41 |
N |
¡¡ | |
SRCC |
P |
FC62 |
46 |
45 |
FC42 |
P |
¡¡ | |
SRCC |
N |
FC63 |
48 |
47 |
FC43 |
N |
¡¡ | |
VRN |
P |
FC64 |
50 |
49 |
FC44 |
P |
¡¡ | |
VRP |
N |
FC65 |
52 |
51 |
FC45 |
N |
¡¡ | |
¡¡ |
P |
FC66 |
54 |
53 |
FC46 |
P |
¡¡ | |
¡¡ |
N |
FC67 |
56 |
55 |
FC47 |
N |
¡¡ | |
¡¡ |
P |
FC68 |
58 |
57 |
FC48 |
P |
¡¡ | |
VREF |
N |
FC69 |
60 |
59 |
FC49 |
N |
VREF | |
¡¡ |
P |
FC70 |
62 |
61 |
FC50 |
P |
¡¡ | |
¡¡ |
N |
FC71 |
64 |
63 |
FC51 |
N |
¡¡ | |
¡¡ |
P |
FC72 |
66 |
65 |
FC52 |
P |
¡¡ | |
¡¡ |
N |
FC73 |
68 |
67 |
FC53 |
N |
¡¡ | |
¡¡ |
P |
FC74 |
70 |
69 |
FC54 |
P |
¡¡ | |
¡¡ |
N |
FC75 |
72 |
71 |
FC55 |
N |
¡¡ | |
¡¡ |
P |
FC76 |
74 |
73 |
FC56 |
P |
SRCC | |
¡¡ |
N |
FC77 |
76 |
75 |
FC57 |
N |
SRCC | |
¡¡ |
P |
FC78 |
78 |
77 |
FC58 |
P |
MRCC | |
¡¡ |
N |
FC79 |
80 |
79 |
FC59 |
N |
MRCC | |
MRCC |
P |
FC100 |
82 |
81 |
FC80 |
P |
¡¡ |
BANK C |
Peripherals I/O Modules
Item Specification CON 1X1 1 connector for stackable height CON 2X1 2 interconnect for 2 horizontal connector CON 1X2 2 interconnect for 2 vertical connector PROBE HEADER HEADER CONNECTORs for Probing - 1 Connector use - 40 header * 4 PROBE MICTOR MICTOR CONNECTORs for Probing - 1Connector use - MICTOR Connector * 4 32MB NorFLASH 32MB Nor Flash - 1 connector use 64MB SDRAM 64MB 32bit Mobile SDR SDRAM Module - Datawidth : 32bit - 1 connector use 128MB DDR SDRAM 128MB 32bit Mobile DDR SDRAM Module - Datawidth : 32bit - 1 connector use DDR2 SO-DIMM DDR2 SO-DIMM for DDR2 SDRAM - Datawidth : 64bit - 2 connectors use DDR3 SO-DIMM DDR3 SO-DIMM for DDR3 SDRAM - Datawidth : 64bit - 2 connectors use UART/USB2.0 2 UART port, USB High-speed GPIF(CY7C68013A) - 1 connector use Gigabit Ethernet Phy Gigabit Ethernet Phy(M88E111) - 1 connector use PCI Express Phy PCI Express Phy 1Lane(PX1011) - 1 connector use
ARM Core Tile Modules
Item |
Specification | |
ARM CT11MPCore |
Four ARM11 MPCore CPUs with VFP and 32KB L1 caches 1MB of unified L2 cache 2 external multiplexed AXI interfaces Tile form factor High density stacking connectors | |
ARM1176 Core Tile |
|
Single ARM1176JZF-S CPU with VFP and 16KB caches and TCMs 128KB of internal AXI RAM ARM *TrustZone Technology On chip ETM11CS with external MICTOR trace connector External multiplexed 64-bit AXI interface |
ARM1136 Core Tile |
|
ARM1136JS-F processor test chip Tile form factor High density stacking connectors Two PISMO¢â connectors for memory expansion boards |
ARM926 Core Tile |
|
ARM926EJ-S processor test chip Tile form factor High density stacking connectors Two PISMO¢â connectors for memory expansion boards |
ARM7 TDMI |
|
ARM7TDMI processor test chip Tile form factor High density stacking connectors Two PISMO¢â connectors for memory expansion boards |
TI DSP TMS320C6416 Module |
|
TI DSP TMS320C6416 SDRAM included |
Core Tile Adaptor |
|
ARM Core Tile to FPGA Modules |
Application
ASIC / SoC Prototyping |
• SoC Rapid Prototyping |
Core Prototyping |
Cortex A8, ARM11, ARM9 |
ARM7, Core A, NEON |
IP Verification |
• DDR2, DDR3, SDRAM, SRAM |
• CMOS Image Sensor |
Image Processing |
• MPEG, MPEG4, M-JPEG, H.264 |
High Speed Test Platform |
• WiBRO Modem Test Platform |
Huins SoC/ASIC Prototyping Projects since 2005~2009
1) MFP-LX330-Nine board
2) RPS7000 & optional boards
4) Huins SoC Verification Platforms
l RPS-3000 Virtex LX330+ARM CoreTile
l Virtex-5 FPGA Module with DRAM
l XilinX Virtex4 + Altera Excalibur (ARM922T)
(4) ARM Emulation Base + MPCore + XilinX FPGA
(4) Huins SoC Verification Platforms
l RPS-3000 Virtex LX330+ARM CoreTile
l RPS-3000 Virtex LX330+ 2 ARM CoreTile
l Virtex-5 FPGA Module with DRAM
l XilinX Virtex4 + Altera Excalibur (ARM922T)
l Altera Excalibur (ARM922T)+ XilinX FPGA
l MFP-LX330Q
l Altera Excalibur SoC verify platform , ARM922T+FPGA, 2003