MFP-LX760-Q is a high performance ASIC prototyping based on quad XilinX LX760 FPGAs for SoC/IP Verification. It is designed for all ASIC prototyping needs,
IP development and end user evaluations.
Advanced process geometries provide new opportunities to integrate more functionality into smaller, lower cost devices. However, as process geometries shrink, design complexity, development time and design risk increase. A growing number of designers are meeting these verification and development challenges and reducing overall risk by using FPGAs to prototype their ASICs and/or initial production. By incorporating the prototyping as part of the verification methodology, a designer
may find a functional bug that was not detected during simulation but could only be uncovered during full system verification. This ability to find problems before taping the design out could save a company millions of dollars in reengineering and tooling costs.
The MFP-LX760-Q and RPS-760x series are Huins's third-generation ASIC Prototyping Systems. Featuring the industry's largest and fastest FPGA, the Virtex 6 LX760 FPGA-based MFP-LX760-Q and RPS-760x series are designed to debug and verify today's most advanced SoC designs. The MFP-LX760-Q and RPS-7604 are able to support designs up to 50 million ASIC gates. By leveraging the system's flexible architecture, both ASIC prototyping systems can be connected to provide support for up to 50 million ASIC gates. The systems are architected and designed to operate at system clock speeds up to 320MHz.
The MFP-LX760-Q ASIC Prototyping Systems set a new standard for ASIC verification, ASIC prototyping, system performance, price/capacity, interconnect flexibility and ease-of-use. The systems offer an organized chassis which includes user add on logic, modules, test codes.
[ MFP-LX760Q Front View with Virtex6 FPGA ]
[ MFP-LX760Q Front View with LX760 and Fan ]
The 30-layer board is carefully designed for maximum performance, with respect to
signal integrity, speed and other critical issues. Signals to connectors and between FPGAs are length matched, thus minimizing skew and allowing very high speed signaling. Many kinds of daughter boards are available for MFP-LX760-Q. And these daughter boards are connected to MFP-LX760-Q through an equidistant matrix
(70x50 mm)
The MFP-LX760-Q is also interfaced with ARM926/1136/1156/1176/MPCore Core Tile (AHB and compressed AXI bus). The MFP-LX760-Q can be used for HW/SW Co-design and Rapid Prototyping System Cores such as MPEG4, H.264, Audio Code 97, CMOS Image Sensor, Color TFT LCD, USB 2.0, and more, as well as debugging and emulating.
Huins is a company to introduce ASIC Prototyping Systems and has been leading the ASIC Prototyping technology for over a decade with its cutting-edge architectures, solutions and methodologies. Its family of RPS-760x Series SoC ASIC Prototyping Systems with high technology allowing any FPGA to directly connect to any other FPGA enables the highest performance in prototyping.
Features
High Performance ASIC / SoC Prototyping System
- Based on quad Xilinx Virtex-6 FPGA XC6VLX760 [1760 pin]
- Flexible Prototyping System
- Support Peripheral I/O modules: DDR3 SO-DIMM, SDRAM, SRAM, Flash memory, Ethernet, DVI/HDMI Interface, PCIe, USB2.0, Ethernet etc
Application
- SoC Verification with FPGA
- Softcore prototyping with FPGA
- H.264, Modem, CIS, MP3 Core, Graphic applications
MFP-LX760-Q is high-speed SoC IP prototyping platform
It is designed for all ASIC prototyping and H/W & S/W co-verification. MFP-LX760-Q is designed for all ASIC prototyping needs, including H/W & S/W co-development and end user evaluations. MFP-LX760-Q is carefully designed for maximum performance, with respect to signal integrity, speed and other critical issues. Signals to connectors and between FPGAs are length matched, thus minimizing skew and allowing very high speed signaling.
MFP-LX760-Q offers a maximum flexibility.
- The same board would be reused in several projects or configurations by replacing optional boards containing I/O and custom subsystems.
- Several option daughter boards are available to mount additional application-specific resources like processors, memory devices, PCI express interfaces, etc.
SoC prototyping for ARM Core Tile
- ARM Core Tile Interface module : Supports AMBA AHB/AXI Bus System
- RealView-ICE/Multi-ICE port
- AMBA IP verification
ARM core tiles are able to interface with MFP-LX760-Q board.
This multi Xilinx Virtex-6 LX760 FPGA and high-performance prototyping platform provides a very flexible modular system which can be used for any ASIC, SOC, or ASSP development. Variety of different add-on modules easily extend the capability of the MFP-LX760-Q.
Option daughter boards
Item |
Specifications |
Comments |
CON1x1 |
Interconnection 1x1 |
|
CON1x2 |
Interconnection 1x2 |
|
CON2x1 |
Interconnection 2x1 |
|
CON2x2 |
Interconnection 2x2 |
|
DEBUG |
MICTOR connector |
|
DDR2 SO-DIMM |
SO-DIMM DDR2 SDRAM module |
|
DDR3 |
DDR3 SDRAM module |
|
SDRAM |
64MB SDR SDRAM module |
|
AsyncSRAM/Flash |
1MB AsyncSRAM, 32MB NorFLASH |
|
DISPLAY/AUDIO |
TFT-LCD connector, CIS connector, VGA port , AC97 audio |
|
COMM |
100/10 Ehternet , USB2.0 HOST/OTG, UART 2port, IrDA 1port |
|
Core Tile |
ARM Core Tile adaptor |
|
CON1x1 Level shifter |
3.3V Level shifter |
|
- CON1x1, CON1x2, CON2x1, CON2x2 daugter boards is usful for more connection.
- DEBUG daughter board with MICTOR connector can be interfaced with Logic Analyzer.